Number of layers :
Single up to 10 layers
Board thickness :
0.20mm ~ 3.20mm
Base laminate type :
CEM-1, CEM-3, FR-4, High Tg 180C
Minium line width / space :
0.10mm / 0.10mm
Minimum hole diameter :
PTH drilled 0.30mm
Punched 0.90mm
Insulation resistance :
1,000 Mohm

Hole position :
+/- 0.075mm (3mil)
Conductor width :
+/- 20%
Hole diameter :
NPTH +/- 0.05mm (2mil)
PTH +/- 0.075mm (3mil)
Outline dimension :
+/- 0.10mm (4mil)
Board flatness :
0.70% Maximum

Panel size:
Minimum 100 x 110mm
Maximum 457 x 609mm
Board thickness :
Minimum 0.80mm
Remain thickness :
Minimum 0.30mm
Tolerance :
+/- 0.10mm
Groove to Groove :
Minimum 10mm
Groove to trace :
Minimum 0.45mm
Groove width :
Maximum 0.50mm

Electro plating Nickel / Gold :
Yes
HASL :
Yes
Flux :
Yes
Peelable solder mask :
Yes
Carbon paste printing :
Yes
Electroless gold (ENIG) :
Yes
Pb Free HASL :
Yes

Single-sided / Double-sided :
150,000 sq ft per month
Multi-layers :
150,000 sq ft per month
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